semiconductor industry innovator with a next generation technology breakthrough for microelectronics system integration and interconnect manufacturing.
*advanced packaging segment
*target market is high-performance computing (HPC), including Data Centers (DC), AI / ML, and high-end edge devices for both commercial and defense applications.
*unique value proposition uses a patented approach with advanced material and manufacturing process IPs for system integration offering interconnect scaling, system design and 3D stacking as a turn-key service.